Hi，welcome To Login KESIN Electronics (Hong Kong) Co., Ltd.！
From the beginning, we have conducted a comprehensive investigation of the qualifications of suppliers and the quality of control. YHX technology has its own quality control team, which can monitor and control quality throughout the process, including purchase, storage and delivery.
In contact with the third -party test capabilities of global authoritative agencies, each high -precision component is strictly tested by using the most advanced testing machine to ensure that its stability and compatibility can meet their requirements.
Anti -static, moisturizing, anti -aging methods and packaging methods will strictly adopt inventory and transportation. We are responsible for returning or replacing components with quality problems.
1. Visual inspection
2. X -ray examination
3. Tag tolerance test
4. Repair capacitance test
5. Pointing allocation test
6. No PB/ROHS test
7. electricity test test
8. Function test
For any component assessment, the first step is also the most important step, that is, a thorough inspection process. We have formulated procedures and acceptance standards to detect and report evidence of adjusting water and renovation.
During the test, the resistance, drug resistance, size verification, marking code matching, high -power amplification detection, terminal conditions, etc. of the solvent are the standard methods in our test process. All inspections and observations are reviewed by quality engineers to evaluate whether we have seen new forging technology or manufacturing.
Check and analyze components to check the integrity of the hardware and changes between different equipment. However, not all variants mean forgery equipment. Understanding the manufacturing process and how the manufacturer's supply chain and engineering control work, we can determine when to manufacture instead of forgery indicators.
The X -ray system is real -time. Objects can rotate all three axes to obtain excellent imaging capabilities and analyze a single component and assembled circuit board.
This is a destructive test that removes the insulation material of the component to reveal death. Then analyze the mold and structure to determine the traceability and reliability of the device. A magnification of 1000 times is a necessary condition for determining the death mark and surface deformation.
Check and analyze components to check the integrity of the hardware and changes between different equipment. However, not all variants mean forgery equipment. Understanding the manufacturing process and how the manufacturer's supply chain and engineering control work, we can determine when to manufacture instead of forgery indicators.
The X -ray system is real -time. Objects can rotate all three axes to obtain excellent imaging capabilities and analyze a single component and assembled circuit board.
This is not a forged method, because oxidation is natural; however, this is an important functional problem, especially in the southeast Asia and North America in the southeast Asia and North America in the southeast Asia and North America under the climate in Southeast Asia and North America, especially in the southeast Asia and North America.The Joint Standard J-STD-002 standard defines test methods and accept / reject standards for brushing, surface mounting, and BGA devices.Packaging is unsuitable packaging, acceptable packaging, but more than one year packaging, or pollution to the pin, it is recommended for solderableness testing.
Third Party authority test room.
Provide one-stop procurement for your cost / save time.
The material list (material list) is fully provided.
International Logistics DHL, Federal Express, UPS, TNT.
The economy will transport goods through Hong Kong.
